Preface

Epoxy adhesives form very strong and durable bonds with most materials and have been widely used as typical reactive adhesives in various bonding applications. A relatively long cure time, ranging from several days at room temperature to at least tens of minutes at elevated temperature, is usually required to cure epoxy adhesives. Recently, several new types of epoxy adhesives that can bond adherends instantly at the specified curing condition while still possessing satisfactory adhesion performance after full cure have been developed and successfully used in advanced applications, such as general bonding, semiconductor packaging, and electronics assembly.

This book describes comprehensive fundamental theory and application knowledge of epoxy adhesive formulation technology. The focus is on basic chemistry, cure methods, and equipment, as well as the latest application developments in instant bonding epoxy technology. The book is divided into six chapters. The Introduction chapter covers basic chemistry in formulating epoxy adhesives with a comprehensive description of various types of epoxy resins, curing agents, and epoxy formulations. Chapter 2 describes fundamental chemistry, UV cure equipment, UV cure epoxy adhesive, and application developments in UV cure cationic epoxy technology. Chapter 3 discusses acrylate chemistry, dual cure hybrid epoxy adhesive, and application developments in UV and thermal cure hybrid epoxy technology. Chapter 4 describes the fundamental chemistry of one-component thermal cure epoxy adhesive and application developments in snap thermal cure epoxy adhesive technology. Chapter 5 discusses fundamental chemistry, the induction heating principle, and induction cure equipment, as well as the introduction to the application of induction cure epoxy technology. Chapter 6 introduces snap ambient cure epoxy technology: fast room temperature cure epoxy adhesive, cyanoacrylate hybrid epoxy adhesive, and UV and room temperature cure epoxy adhesive technology.

As the first comprehensive overview of instant bonding epoxy technology, this book is an invaluable textbook for researchers, formulating chemists, and application engineers related to polymer science and technology in both academia and industrial societies.